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  november 2011 doc id 18076 rev 3 1/12 12 SPV1001 cool bypass switch for photovoltaic applications features i f = 16 a, v r = 40 v very low forward voltage drop very low reverse leakage current 175 c operating junction temperature applications photovoltaic panels description the SPV1001 is a system-i n-package solution for photovoltaic applications to perform cool bypass rectification similar to that of a conventional schottky diode but with much lower forward voltage drop and reverse leakage current. the device consists of a power mosfet transistor which charges a capacitor during the off time, and drives its gate during the on time using the charge previously stored in the capacitor. the on and off times are set to reduce the average voltage drop across the drain and source terminals, resulting in reduced power dissipation. a k a a k k a to220 d 2 pa k table 1. device summary order codes package packaging SPV1001d40 d 2 pac k tu b e SPV1001d40tr tape and reel SPV1001t40 to220 tube www.st.com
maximum ratings SPV1001 2/12 doc id 18076 rev 3 1 maximum ratings 1.1 absolute maximum ratings 1.2 thermal data table 2. absolute maximum ratings symbol parameter range [min, max] unit v r max dc reverse voltage 40 v i f max. forward current 16 a i fsm non repetitive peak surge (half-wave, single-phase, 60 hz) 250 a esd level human body level 8 k v table 3. thermal data symbol parameter value unit r thjc thermal resistance, junction-to-ambient (d 2 pak, to220) 1.5 c/w t j junction temperature operating range -40 to 175 c t stg storage temperature range -40 to 175 c
SPV1001 electrical characteristics doc id 18076 rev 3 3/12 2 electrical characteristics table 4. electrical characteristics symbol parameter test condition values unit min typ max v f, av g avg forward voltage drop if = 16a (1) 1. for correct power dissipation and heatsink sizing, please refer to figure 1 , 4 e 7 t j = 25c - 230 - mv if = 8a (1) t j = 25c - 120 - mv t j = 125c - 270 - mv i r reverse leakage current vr = 40v t j = 25c - 1 - a t j = 125c - 10 - a d ton/t ratio if = 8a (1) t j = 25c - 95% - - t j = 125c - 75% - - v f forward voltage drop if = 8a, t off tj = 25c - 920 - mv t j = 125c - 600 - mv if = 8a (1) , t on t j = 25c - 70 - mv t j = 125c - 160 - mv
device description SPV1001 4/12 doc id 18076 rev 3 3 device description a photovoltaic panel consists of a series of pv cells. in optimal conditions, all the cells are equally irradiated and function at the same current level. however, during normal operation some cells may become partially shaded or ob scured. these shaded cells limit the current generated by the fully irradiated cells and, in the extreme cases where these cells are totally obscured, the current flow is blocked. in this case the shaded cells behave like a load, and the current generated from the fully irradiated cells produces overvoltages which can reach the breakdown threshold. this phenomenon, known as a ?hot spot?, can cause overheating of the shaded cells and, in some cases, even permanent damage resulting in current leakage. to prevent hot spots, therefore, bypass diodes are connected in parallel to the cell strings. the device described here has the same functionality as a schottky diode, but with improved performance. it features very low forward voltage drop and reverse leakage current. it consists of a power mosfet transistor which charges a capacitor during the off time, and drives its gate during the on time using the charge previously stored in the capacitor. the on and off times are set to reduce the average voltage drop across the drain and source terminals, resulting in reduced power dissipation.
SPV1001 device description doc id 18076 rev 3 5/12 figure 1. average forward power dissipation vs average forward current figure 2. forward voltage  fp    fp    fp    fp   7 ?&  khdwvlqnhu(sr[\sulqwhgerdug)5&x xp 3 ) $9 :      , ) $9 $ !-v >dn  >dn  >dn  >dn  !-v                   )ruzdug&xuuhqw $ )ruzdug9rowdjh p9 figure 3. reverse current figure 4. thermal resistance junction-to- ambient vs copper surface under tab (1) 1. epoxy printed board fr4, cu = 35 m 5?$ 5?$ 5?$ !-v x      ?  ? ? ?? ? ?? e e? ? ?! 7 5?$ 5?$ !-v                   6 fpe 5 ?&: wk md
device description SPV1001 6/12 doc id 18076 rev 3 figure 5. average forward power dissipation vs average forward current @ 25c of ambient temperature figure 6. average forward power dissipation vs average forward current @ 75c of ambient temperature !-v x x ?x ?x ??e?????e? w&zs'~t /&zs'~ w&??? ?x?u? ?u? x?u? u? !-v x x ?x ?x   ? ? e ?   ? ?   ? ? e ? w&zs'~t /&zs'~ w&?? ?x?u? ?u? x?u? u? figure 7. average current versus ambient temperature !-v  ? e  ?  ? e  ?  ?? ? ?  ?? ? ? z ?z~ir az ?z~ir z ?z~ir a??lt / &~s ~ d u ~?
SPV1001 package mechanical data doc id 18076 rev 3 7/12 4 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220 type a mechanical data dim. mm min. typ. max. a 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 d 15.25 15.75 d1 1.27 e10 10.40 e 2.40 2.70 e1 4.95 5.15 f 1.23 1.32 h1 6.20 6.60 j1 2.40 2.72 l13 14 l1 3.50 3.93 l20 16.40 l30 28.90 ? p 3.75 3.85 q 2.65 2.95
package mechanical data SPV1001 8/12 doc id 18076 rev 3 figure 8. to-220 type a drawing 00159 88 _typea_rev_ s
SPV1001 package mechanical data doc id 18076 rev 3 9/12 table 6. d2pak (to-263) mechanical data dim. mm min. typ. max. a 4.40 4.60 a1 0.03 0.23 b 0.70 0.93 b2 1.14 1.70 c 0.45 0.60 c2 1.23 1.36 d 8.95 9.35 d1 7.50 e10 10.40 e1 8.50 e2.54 e1 4.88 5.28 h15 15.85 j1 2.49 2.69 l 2.29 2.79 l1 1.27 1.40 l2 1.30 1.75 r0.4 v2 0 8
package mechanical data SPV1001 10/12 doc id 18076 rev 3 figure 9. d2pak (to-263) drawing 0079457_r
SPV1001 revision history doc id 18076 rev 3 11/12 5 revision history table 7. document revision history date revision changes 30-mar-2011 1 initial release 14-jun-2011 2 ? added d 2 pak package ? document status promoted from preliminary data to full datasheet ? part number in title changed to SPV1001 ? minor text changes 11-nov-2011 3 updated figure 3
SPV1001 12/12 doc id 18076 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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